Introduction, microfabrication and micromachining fundamentals, scaling effects, mechanics and transduction at microscale, actuation and sensing methods – Electrostatic, piezoelectric, thermal, electromagnetic, resonant, tunneling and microfluidic techniques. Capacitative sensors, resonators, lab on chip devices, microfluidic devices, micromirrors, assembly techniques for MEMS, microsystem packaging. Three lectures; second term Prerequisite(s): Registration in Level IV or above of any Mechanical Engineering program or permission of the department
